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R3-PowerUP

 

r3powerup logoUNIPI Team Leader: Giuseppe Barillaro , Dipartimento di Ingegneria dell'informazione

 

R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction (ref. to COP21 Agreement ), as well as Sustainable Environment through electric mobility and industrial power efficiency.

  • Development and demonstration of a brand new 300mm advanced manufacturing facility addressing a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing)
  • Improvement in productivity and competitiveness of integrated IC solutions for smart power and power discrete technologies.

The strategy of the project is the following:

  • The Pilot Line will enable the realization of sub-100nm Smart Power processes, starting from the 90nm BCD10 process, taking profit from the advanced and peculiar equipments available only for 300mm wafer size.
  • The availability of a 300mm full processing line will also exploit the portability to 300mm of the most critical and expensive process steps devoted to power discrete devices.
  • The Pilot Line will build on Digital Factory and Industry 4.0 principles, enforcing a flexible, adaptive and reliable facility, in order to investigate also the synergy and economic feasibility of supporting both Smart Power and power discrete processes in the same manufacturing line.
  • The application of such technologies will be a breakthrough enabler for Energy Efficiency and CO2 Reduction worldwide, in line with COP21’s global action plan.

The Pilot Line is based on three main pillars:

  1. Market driven continuous innovation on smart-power and power discrete;
  2. Industrial policy focused on high quality and mass production’s cost optimization;
  3. Set the ground for future wafer upgrade of “More than Moore” disruptive technologies (e.g. advanced MEMS manufacturing, now at 200mm)

Coordinator
STMICROELECTRONICS SRL Italy

Participants

  • POLITECNICO DI TORINO Italy
  • CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LA NANOELETTRONICA Italy
  • UNIVERSITA DI PISA Italy
  • UNIVERSITA DEGLI STUDI DI PAVIA Italy
  • CONSIGLIO NAZIONALE DELLE RICERCHE Italy
  • ROBERT BOSCH GMBH Germany
  • KLA-Tencor MIE GmbH Germany
  • ICOS VISION SYSTEMS NV Belgium
  • ASM EUROPE BV Netherlands
  • BESI AUSTRIA GMBH Austria
  • DISCO HI-TEC EUROPE GMBH Germany
  • ADVANCED PACKAGING CENTER BV Netherlands
  • SLOVENSKA TECHNICKA UNIVERZITA V BRATISLAVE Slovakia
  • NANO DESIGN SRO Slovakia
  • PICOSUN OY Finland
  • SILTRONIC AG Germany
  • INSTITUT MIKROELEKTRONICKYCH APLIKACI S.R.O. Czech Republic
  • VYSOKE UCENI TECHNICKE V BRNE Czech Republic
  • INSTYTUT TECHNOLOGII ELEKTRONOWEJ Poland
  • AUTOMATIX SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA Poland
  • UNIVERSITATEA POLITEHNICA DIN BUCURESTI Romania
  • greenpower technologies Spain
  • UNIVERSIDAD DE SEVILLA Spain
  • APPLIED MATERIALS FRANCE France
  • APPLIED MATERIALS ISRAEL LTD Israel
  • NOVA MEASURING INSTRUMENTS LTD Israel
  • SOITEC SA France
  • AP&S INTERNATIONAL GMBH Germany
  • EV GROUP E. THALLNER GMBH Austria
  • ANCOSYS GMBH Germany
  • LAM RESEARCH SAS France
  • ATOTECH DEUTSCHLAND GMBH Germany
  • LASER SYSTEMS & SOLUTIONS OF EUROPE France
  • APPLIED MATERIALS IRELAND LIMITED Ireland

 

Start date 01/11/2017
End date 30/04/2021
Duration 42 months
Project cost 180 318 047,50 €
Project funding 28.046.206,50 €
UNIPI quota 122.500 €
Call title H2020-ECSEL-2016-2-IA-two-stage
Funding scheme ECSEL-IA - ECSEL Innovation Action
UNIPI role Partner

Project website: https://r3powerup.eu/

Ultima modifica: Ven 11 Gen 2019 - 12:46

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